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Potting & Encapsulation Systems
CASS Polymers :: Tool Chemical :: TCC Epoxy Resin Systems :: Potting & Encapsulation Systems ::
 
TCC Potting and Encapsulation Systems were specifically developed for the economical potting, casting, embedding, and encapsulation of electronic circuits and components.
 
Potting & Encapsulation Systems  

  TCC-626N/TCC-116A
Exhibits excellent thermal shock characteristics, low thermal degradation properties and high impact resistance at elevated temperatures. 
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  TCC-702A/TCC-702B
May be cast bonded to metal and other low cost cores to provide close tolerance, intricate-detail forming surfaces. 
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  TCC-704/TCC-104
Designed for the encapsulation of electronic and magnetic components. 
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